Electrical connector semiconductor package with fly-over signal paths
US6984132B1 · kind B1 · utility
Inventors
Key dates
| Filing date | Jan 17, 2004 |
| Grant date | Jan 10, 2006 |
| Priority date | — |
| Expiry date | Jan 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/222
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical connector semiconductor package with electrically conductive “fly-over” paths wherein semiconductor package hermetically seals one or more substrate comprising one or more semiconductor devices, such as active or passive ICs, and other semiconductor components. Semiconductor package with “fly-over” paths comprises a first package face comprising a first set of connector terminations, such as a set of connector pins that receive a set of incoming external signal. Semiconductor package with “fly-over” paths also comprises a second package face comprising a second set of connector termination, wherein the second set of connector terminations might comprise a set of connector pin cusps to couple to an external board or another connector. One or more of the first set of connector terminations are provided to couple a set of incoming external signals to the one or more semiconductor devices on a substrate via a set of signal pins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.