Connector for surface mounting subassemblies vertically on a mother board and assemblies comprising the same
US6984156B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2003 |
| Grant date | Jan 10, 2006 |
| Priority date | — |
| Expiry date | Jan 19, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In accordance with the invention a surface mount connector is provided for vertically mounting one circuit device on another. By “vertically mounting” is meant that a circuit device with a major surface is mounted perpendicular to the major surface of another circuit device. The connector is a conductive body comprising a base section and a transverse section, the base section having a width greater than the transverse section and a length which extends beyond the transverse section. Advantageously, the base section extends beyond the transverse section in front, behind and on both sides. In typical use, a major surface of a subassembly can be connected to the transverse section and an edge of the subassembly can be connected to the base extensions. The base can then be connected to the mother board. With this mounting, problems of co-plurality are substantially eliminated, higher densities in the use of subassemblies can be achieved and low resistance, low inductance connection can be provided along with effective heat dissipation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.