Bond enhancement for thermally insulated ceramic matrix composite materials
US6984277B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2003 |
| Grant date | Jan 10, 2006 |
| Priority date | — |
| Expiry date | Sep 2, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A composite structure (62) having a bond enhancement member (76) extending across a bond joint (86) between a ceramic matrix composite (CMC) material (80) and a ceramic insulation material (82), and a method of fabricating such a structure. The bond enhancement member may extend completely through the CMC material to be partially embedded in a core material (84) bonded to the CMC material on an opposed side from the insulation material. A mold (26) formed of a fugitive material having particles (18) of a bond enhancement material may be used to form the CMC material. A two-piece mold (38, 46) may be used to drive a bond enhancement member partially into the CMC material. A compressible material (56) containing the bond enhancement member may be compressed between a hard tool (60) and the CMC material to drive a bond enhancement member partially into the CMC material. A surface (98) of a ceramic insulation material (92) having a bond enhancement member (96) extending therefrom may be used as a mold for laying up a CMC material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.