Siloxane-modified polyimide resin
US6984714B2 · kind B2 · utility
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4Claims
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Key dates
| Filing date | Apr 23, 2003 |
| Grant date | Jan 10, 2006 |
| Priority date | — |
| Expiry date | May 31, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to a siloxane-modified polyimide resin which shows excellent adhesiveness and can be bonded by thermocompression at high temperature even after subjection to thermal hysteresis in the manufacturing step for electronic parts. This polyimide resin is obtained from an aromatic tetracarboxylic acid dianhydride (A) and a diamine (B) comprising 30–95 mol % of a bis(4-aminophenoxy)alkane (B1) and 5–70 mol % of a siloxanediamine (B2) as essential components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.