Electrical slip ring platter multilayer printed circuit board and method for making same
US6984915B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 22, 2003 |
| Grant date | Jan 10, 2006 |
| Priority date | — |
| Expiry date | Oct 11, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53143
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A slip ring and a method for manufacturing a slip ring utilizes a first double clad copper laminate with a first side and a second side separated by a first dielectric and a second double clad copper laminate with a third side and a fourth side separated by a second dielectric. Copper is selectively removed from the second and third sides to provide desired patterns in the copper. The second and third sides are joined in a desired orientation. Substantially, all of the copper from a window in the first and fourth sides is removed to expose the first and second dielectrics. A plurality of concentric grooves is machined into the first and second dielectrics from the first and fourth sides and the concentric grooves are metalized to provide a plurality of concentric metalized rings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.