Thermal control of a DUT using a thermal control substrate
US6985000B2 · kind B2 · utility
101Cited by
33References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2004 |
| Grant date | Jan 10, 2006 |
| Priority date | — |
| Expiry date | Jul 28, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67248
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A solid state thermal control device contains a substrate and a plurality of solid state thermal elements on the substrate. The thermal elements are adapted to provide thermal control to a device under test (DUT). Each solid state thermal element contains at least one solid state heater and an active control circuit adapted to control a thermal output of the heater. Optionally, the each thermal element may also include a solid state temperature sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.