IC card
US6986467B2 · kind B2 · utility
15Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2003 |
| Grant date | Jan 17, 2006 |
| Priority date | — |
| Expiry date | Sep 1, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48465
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An IC card includes a first support; a second support; an IC module including an IC chip, a reinforcing structural member neighboring to the IC chip and an antenna; the IC module providing between the first and second supports; a first adhesive layer provided between the first support and the IC chip; and a second adhesive layer provided between the first support and the IC chip. The IC card has a rebound coefficient (h/h0) of 0.52 to 0.70, where h0 is a dropping height from which a steel ball is dropped onto the IC card and h is a rebound height to which the steel ball rebounds from the IC card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.