Wafer refining
US6986698B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 20, 2002 |
| Grant date | Jan 17, 2006 |
| Priority date | — |
| Expiry date | Jan 12, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of in situ control for finishing semiconductor wafers to improve cost of ownership is discussed. A method to use business calculations combined with physical measurements to improve control is discussed. The use of lubricating layer control in the operative finishing interface is discussed. Use of business calculations to change the cost of finishing semiconductor wafers is discussed. The method aids control of differential lubricating films and improved differential finishing of semiconductor wafers. The method aids cost of manufacture forecasting. The method can help manage and/or reduce cost of manufacture for pre-ramp-up, ramp-up, and commercial manufacture of the workpieces. The method can aid cost of manufacture forecasting for pre-ramp-up, ramp-up, and commercial manufacture of the workpieces. The method can aid process control for pre-ramp-up, ramp-up, and commercial manufacture of workpieces. Activity based accounting can be preferred for some applications. Planarization and localized finishing can be improved using differential lubricating films for finishing. New methods and new apparatus for finishing control are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.