Polishing pad and method of producing the same
US6986706B1 · kind B1 · utility
9Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2004 |
| Grant date | Jan 17, 2006 |
| Priority date | — |
| Expiry date | Aug 10, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/921
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad has a working layer provided with an abrasive powder, an attaching layer for attaching a pad to a polishing head of a power tool, and a connection layer which connects the working layer with the attaching layer, the connection layer being located between the working and the attaching layer and having a peripheral region which is thinner and also a central region which is thicker than the peripheral region and therefore has an increased elasticity so that during polishing an elasticity of a central portion of the working layer is increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.