Component assembly with solder glass preform for lighting device and sealing process
US6987359B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2002 |
| Grant date | Jan 17, 2006 |
| Priority date | — |
| Expiry date | Dec 21, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J61/366
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed are a component assembly for an electrical lighting device and method for sealing the same. The assembly comprises the component, such as an electrode lead wire, and a solder glass perform. The component assembly is useful, for example, in hermetically sealing and affixing lamp components, such as electrical lead wires and exhaust tubulation, to a low-pressure fluorescent discharge lamp envelope having phosphor coating already applied thereto without causing damage to other lamp components sensitive to high temperature. The present invention is particularly suitable for lamp envelope made of borosilicate glass having a CTE from 0 to 300° C. in the range of 30–45×10−7° C.−1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.