Method and system for cooling electronic components
US6987370B2 · kind B2 · utility
30Cited by
12References
103Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2003 |
| Grant date | Jan 17, 2006 |
| Priority date | — |
| Expiry date | Jun 23, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A localized system for dissipating heat generated by an electronic component includes a controllable cooling element and a control system for controlling the cooling element. The control system adjusts a speed of operation of the cooling element in response to variations in power consumption of the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.