Channeled flat plate fin heat exchange system, device and method
US6988535B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2003 |
| Grant date | Jan 24, 2006 |
| Priority date | — |
| Expiry date | Oct 30, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A device, method, and system for a fluid cooled channeled heat exchange device is disclosed. The fluid cooled channeled heat exchange device utilizes fluid circulated through a channel heat exchanger for high heat dissipation and transfer area per unit volume. The device comprises a highly thermally conductive material, preferably with less than 200 W/m-K. The preferred channel heat exchanger comprises two coupled flat plates and a plurality of fins coupled to the flat plates. At least one of the plates preferably to receive flow of a fluid in a heated state. The fluid preferably carries heat from a heat source (such as a CPU, for example). Specifically, at least one of the plates preferably comprises a plurality of condenser channels configured to receive, to condense, and to cool the fluid in the heated state. The fluid in a cooler state is preferably carried from the device to the heat source, thereby cooling the heat source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.