Security tag and process for making same

US6988666B2 · kind B2 · utility

Assignee

• CHECKPOINT SYSTEMS, INC. · US

Inventors

• Lawrence Appalucci · Villanova, US
• Andre Cote · Williamstown, US
• David Lopez Perez · Ponce, US
• Gary Mazoki · Sewell, US
• Anthony F. Piccoli · Audubon, US
• Rolando Martinez · Ponce, US
• Luis Soler Bonnin · Guánica, US
• Takeshi Matsumoto · Soma, JP
• Hideaki Imaichi · Chigasaki, JP

Key dates

• Filing date: Sep 5, 2002
• Grant date: Jan 24, 2006
• Expiry date: Dec 23, 2023

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1085
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A tag and method of making it. The tag includes a first adhesive layer provided in a first predetermined pattern between a surface of a first substrate and a first conductive foil. The first pattern corresponds to a pattern for a first conductive trace, e.g., a portion of a resonant circuit. The first conductive foil is laminated, e.g., adhesively secured, to the surface of the first substrate to form a first conductive layer. A first portion of that layer is shaped, e.g., die-cut, to generally correspond to the first pattern. A second portion of the first conductive layer not corresponding to the first portion is removed, to establish the first conductive trace, with the adhesive layer confined within the boundaries of the first conductive trace. Another conductive trace is secured to the first conductive trace, with a dielectric therebetween, to form a resonant circuit.