Injection molding apparatus having a nozzle tip and a tip surrounding piece of equal thermal conductivity
US6988883B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2004 |
| Grant date | Jan 24, 2006 |
| Priority date | — |
| Expiry date | Jul 30, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/2766
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An injection molding apparatus is provided. The injection molding apparatus includes a manifold having at least one runner that receives melt from a melt source, a heat source for heating the melt, a nozzle in fluid communication with the manifold, and a mold component having a mold cavity for receiving melt from the nozzle. The nozzle includes a nozzle body having a melt passage therethrough, a nozzle tip having a tip melt passage therethrough, wherein the tip melt passage is in fluid communication with the melt passage of the nozzle body, and a tip surrounding piece that is removably coupled to the nozzle body. The tip surrounding piece retains the nozzle tip in position with respect to the nozzle body. The tip surrounding piece is preferably formed of a material that has a thermal conductivity that is equivalent to that of the nozzle tip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.