Electronic assembly, and apparatus and method for the assembly thereof
US6988899B2 · kind B2 · utility
2Cited by
17References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2004 |
| Grant date | Jan 24, 2006 |
| Priority date | — |
| Expiry date | Apr 19, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/381
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An electronic assembly having a first layer and a second layer is disclosed. The first layer has a first interface surface and a plurality of cavities formed in the first interface surface. The second layer has a second interface surface and a plurality of projections disposed at the second interface surface, where the plurality of projections are aligned with and disposed at the plurality of cavities. An electrically conductive connecting material is disposed at the plurality of cavities such that the connecting material connects the plurality of projections to the respective plurality of cavities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.