Polymeric void-board
US6989184B2 · kind B2 · utility
5Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2004 |
| Grant date | Jan 24, 2006 |
| Priority date | — |
| Expiry date | Mar 18, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2457
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
An extruded polymeric void-board is configured for placement between adjacent horizontal layers of bricks to maintain an opening in a lower layer of the bricks. The void-board is formed as a relatively thin planar element having first and second surfaces. A plurality of parallel ribs extend from and generally transverse to the first side. The ribs have a predetermined height to width ratio and have a height that is less than a thickness of the planar element. The ribs being formed parallel to one another. A method for forming a bundle of bricks with the void-board is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.