Copper foil for printed-wiring board and copper-clad laminate using copper foil for printed-wiring board
US6989199B2 · kind B2 · utility
9Cited by
10References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2002 |
| Grant date | Jan 24, 2006 |
| Priority date | — |
| Expiry date | Jan 1, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The object is to provide a copper foil excellent in the property of selective etching between a resistor layer and a copper layer required in production of a printed-wiring board, and also excellent in UL heat resistance. For this purpose, a copper foil for printed-wiring board comprising a nodular treatment side on one side, wherein a nickel-zinc alloy layer is formed on the nodular treatment side is used for applications of printed-wiring boards. At the same time, a production method suitable for production of the copper foil is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.