Method for making an integrated circuit of the surface-mount type and resulting circuit
US6989591B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 18, 2000 |
| Grant date | Jan 24, 2006 |
| Priority date | — |
| Expiry date | May 23, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for making an integrated circuit (40) of the surface-mount type the comprising, first of all, manufacture of a package having a rear face and a pin grid array extending under this rear face perpendicular thereto, and a ball (44) of low melting point alloy is then formed at the end of each pin surrounding this end and soldered thereto.The invention also relates to an integrated circuit (40) of the surface-mount type, comprising a package having a rear face and a pin grid array, of a cross section roughly constant along the pin (42), extending under the rear face perpendicular thereto. A ball (44) of low melting point alloy is soldered to the end of each pin (42) surrounding this end.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.