Ultra fine particle film forming method and apparatus
US6991515B2 · kind B2 · utility
41Cited by
10References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 20, 2003 |
| Grant date | Jan 31, 2006 |
| Priority date | — |
| Expiry date | Oct 20, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1344
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A ultra fine particle film forming apparatus is provided which is capable of forming a ultra fine particle film which has ultra fine particles sufficiently bonded together, sufficient density, flat surface and uniform density. A planarized ultra fine particle film forming method for forming a planarized ultra fine particle film from a deposited film of ultra fine particles formed by supplying the ultra fine particles to a substrate, the method comprising one or more of a planarizing step of planarizing a surface of the deposited film of the ultra fine particles supplied to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.