Method of forming a high-voltage/high-power die package
US6991961B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2003 |
| Grant date | Jan 31, 2006 |
| Priority date | — |
| Expiry date | Nov 30, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a high voltage component package, which includes providing a flexible non-conductive substrate, forming a conductive layer on the substrate, and forming a circuit trace from the conductive layer, the circuit trace having frangible leads. A first side of a component overlies at least a portion of the circuit trace, and the component is coupled to the circuit trace by breaking a frangible lead on the trace and bonding the lead to the component. The flexible substrate is then bent or folded such that another portion of the circuit trace is in proximity to a second side of the component. The trace is coupled to the second side of the component either with a conductive adhesive or by bonding with another frangible trace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.