Method for embedding a component in a base and forming a contact
US6991966B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 28, 2003 |
| Grant date | Jan 31, 2006 |
| Priority date | — |
| Expiry date | Jan 28, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention includes a method, in which at least some of the semiconductor components forming part of an electronic circuit are embedded in a base, such as a circuit board, during the manufacture of the base. Thus, the base structure is basically manufactured around the semiconductor component. According to the invention, at least one conductive pattern and through holes for the semiconductor components are made in the base. Thereafter, the semiconductor components are placed in the holes in alignment with the conductive pattern. The semiconductor components are attached to the structure of the base, and one or more conductive pattern layers are made in the base in such a way that at least one conductive pattern forms an electrical contact with the contact areas of the surface of the semiconductor component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.