Method and system for drying semiconductor wafers in a spin coating process
US6992023B2 · kind B2 · utility
0Cited by
9References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 20, 2002 |
| Grant date | Jan 31, 2006 |
| Priority date | — |
| Expiry date | Dec 21, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides methods and apparatus for drying the backside of semiconductor wafers in a spin-coating environment. Solvent is evaporatively dried from a semiconductor wafer held in a spin mechanism. The undried wafer is sprayed with one or more jets of pressurized gas from gas ports disposed about the spin mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.