Patent · US Expired

Very low melt viscosity resin

US6992146B2 · kind B2 · utility

19Cited by
3References
26Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 29, 2004
Grant dateJan 31, 2006
Priority date
Expiry dateDec 29, 2024

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L53/00
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A process is provided for the production of a very low melt viscosity (high melt flow index) polymer resin, suitable for use in spunbond or meltblown processing. According to the process of the current invention, a high melt viscosity (low melt flow index) resin is subjected to post-reactor molecular weight alteration by extrusion with a chemical prodegradant. The process produces a very low melt viscosity resin that can be used in spunbond or meltblown processing without further treatment to reduce the average molecular weight of the resin. Further, the very low melt viscosity resins produced according to the process of the current invention contain very little or no residual prodegradant.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.