Electronic component housing package and electronic apparatus
US6992250B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2005 |
| Grant date | Jan 31, 2006 |
| Priority date | — |
| Expiry date | Feb 25, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component housing package includes a base body made of a metal; a rectangular frame body made of a metal; an input/output terminal made of insulating material, which has line conductor for electrically conductively connecting the interior and exterior of the frame body; and an input/output terminal mounting portion, into which input/output terminal is fitted and which is formed as a notch extending across two adjacent corners of a frame body's lower part. The input/output terminal is so configured that its opposed end-face pair at two corners are made flush with opposed outer-side-surface pair including two corners of frame body, and that metal layer is applied to both of a part of an input/output terminal's end-face extending along the mounting portion and another part thereof extending along the base body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.