Sputtering target assemblies using resistance welding
US6992261B2 · kind B2 · utility
32Cited by
14References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2003 |
| Grant date | Jan 31, 2006 |
| Priority date | — |
| Expiry date | Feb 15, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/3407
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of forming a sputtering target assembly and other metal articles is described. Sputtering target assemblies and metal articles are also described. The method includes bonding a sputter target to a backing plate using resistance heating or welding to bond assembly members that respectively include mating projections and grooves formed in bonding surfaces thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.