Method and apparatus for localized control of a plasma cutter
US6992262B2 · kind B2 · utility
28Cited by
11References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2003 |
| Grant date | Jan 31, 2006 |
| Priority date | — |
| Expiry date | Oct 9, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/3494
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present invention is directed to a system and method for a plasma cutting system including a plasma cutting power source and a plasma torch operationally connected to the plasma cutting power source. A processing unit is disposed within the plasma torch and is configured to control the plasma cutting power source during a plasma cutting process based on operational feedback gathered of the plasma cutting process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.