Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery
US6992378B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2000 |
| Grant date | Jan 31, 2006 |
| Priority date | — |
| Expiry date | Jan 17, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A socket and package apparatus are disclosed for increasing the amount of power that can be delivered from an IC board to an IC where the IC package is mounted in a socket connected to the IC board. The apparatus has two separable and distinct parts designed to electrically engage. The package is designed with a power bar where the panels of the power bar are permanently and electrically connected to various power planes of the IC package along its entire adjacent wall. The socket is designed with a power bar carrier designed to maximize the current flow from the IC board to the power bar. The package is then engaged into the socket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.