Encapsulated electronics device with improved heat dissipation

US6992400B2 · kind B2 · utility

Assignees

• Nokia · FI
• EPCOS AG · DE

Inventors

• Pasi Tikka · Munich, DE
• Edgar Schmidhammer · Stein an der Traun, DE
• Habbo Heinze · Unterschleißheim, DE
• Reiner Welzer · Birkenfeld, DE
• Herbert Zidek · Munich, DE
• Ansgar Schäufele · Munich, DE
• Juha Ellä · Halikko, FI

Key dates

• Filing date: Jan 30, 2004
• Grant date: Jan 31, 2006
• Expiry date: Feb 5, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H03H2003/025
• WIPO field: Basic communication processes
• WIPO sector: Electrical engineering

Abstract

A method for improving heat dissipation in an encapsulated electronic package usually referred to as a chip-size SAW package. The package comprises one or more acoustic-wave components fabricated on a die, which is disposed on an electrically non-conductive carrier separated by electrically conducting bumps. The top of the package is covered by a laminate and a hermetic seal layer. Heat dissipation can be improved by removing a part of the laminate and then depositing a layer of thermal conducting material on the package, and by providing one or more heat conducting paths through the carrier.