Parallel cooling of heat source mounted on a heat sink by means of liquid coolant
US6992888B1 · kind B1 · utility
29Cited by
11References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 8, 2004 |
| Grant date | Jan 31, 2006 |
| Priority date | — |
| Expiry date | Mar 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A module includes a cold plate. Solid-state heat sources are thermally mounted on the cold plate in a chamber defined by the cold plate and a lid. Cooling of the heat sources is enhanced by a dielectric liquid within the chamber. The liquid has a boiling point slightly below the temperatures of “hot” spots, to form small bubbles during operation, which enhance convection flow. The liquid may be a mixture of fluorocarbons of different boiling points. The liquid may contain diamond particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.