Patent · US Expired

Micro-connector structure and fabricating method thereof

US6994578B1 · kind B1 · utility

8Cited by
1References
6Claims
0Family size

Assignee

Inventor

Key dates

Filing dateAug 28, 2004
Grant dateFeb 7, 2006
Priority date
Expiry dateAug 28, 2024

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S439/931
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

MICRO-CONNECTOR STRUCTURE AND method of making the same are disclosed. The micro-connector is microminiaturized and improved its degree of compaction by using semiconductor process. The process is etching silicon substrates into V-shaped channels and then a layer of nanometer structure is grown on them to increase stability of conductivity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.