Fabricating surface mountable semiconductor components with leadframe strips

US6995029B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Joerg Sorg · Regensburg, DE
• Gertrud Kraeuter · Regensburg, DE

Key dates

• Filing date: Aug 5, 2003
• Grant date: Feb 7, 2006
• Expiry date: Aug 5, 2023

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T436/188
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to a method for producing an electrical leadframe (10), in particular for a light-emitting diode component, having at least one first electrical connection conductor (2) and at least one second electrical connection conductor (3). The method includes a) production of a layer composite comprising an electrically insulating carrier layer (101) and an electrically conductive connection conductor layer (102), b) patterning of the carrier layer (101) in such a way that at least one contact-making window (7) toward the connection conductor layer (102) is produced in said carrier layer, and c) patterning of the connection conductor layer (102), in such a way that the first electrical connection conductor (2) and the second electrical connection conductor (3) are produced, at least one of which can be electrically connected through the contact-making window (7). The invention also relates to a leadframe strip having a connection conductor layer and a connection carrier layer, on which an array with a multiplicity of component regions is formed, the connection conductor layer being at least partly removed along separating lines between two adjacent component regions.