HF module and method of assembling the same
US6995314B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 19, 2003 |
| Grant date | Feb 7, 2006 |
| Priority date | — |
| Expiry date | Nov 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q9/0414
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present invention relates to measures that enable simple assembly of a high-frequency (HF) module. The HF module includes a HF circuit board (1), on which at least one first antenna part (6) is located, a housing part (2), on which at least one second antenna part (7) is located, and a shielding cover (3), whereby the HF circuit board (1) is installed between the housing part (2) and the shielding cover (3). With the aid of the measures according to the present invention, the housing part (2) and the shielding cover (3) can be easily adjusted relative to the HF circuit board (1). A reliable connection between these three parts can also be achieved with relatively little outlay.To this end, the HF circuit board (1) includes, according to the present invention, at least one through opening (8), while the housing part (2) has at least one peg (10) which extends into the through opening (8). The peg (10) is connected with the diametrically opposed surface (14) of the shielding cover (3).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.