Electrical circuit board and a method for making the same
US6998540B2 · kind B2 · utility
6Cited by
11References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2003 |
| Grant date | Feb 14, 2006 |
| Priority date | — |
| Expiry date | Feb 8, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26 which have improved solder-wetting characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.