Apparatus and method for heating micro-components mounted on a substrate
US6998587B2 · kind B2 · utility
3Cited by
14References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2003 |
| Grant date | Feb 14, 2006 |
| Priority date | — |
| Expiry date | Dec 18, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/017
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A package for heating a micro-component is disclosed. The package comprises a platform having a resistive heating element integral with the platform. The package further includes a micro-component disposed on the platform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.