Optoelectronic device packaging with hermetically sealed cavity and integrated optical element
US6998691B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2003 |
| Grant date | Feb 14, 2006 |
| Priority date | — |
| Expiry date | Feb 18, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/183
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A package for an optoelectronic device includes a hermetically sealed cavity into which a mirror or other optical element is integrated. For a side-emitting laser, an integrated mirror turns the light emitted from the laser inside the cavity so that the light exits through a top surface of the package. The packaging can be implemented for individual lasers or at the wafer level. A wafer level process fabricates sub-mounts in a first wafer, fabricates depressions with reflective areas in a second wafer, electrically connects optoelectronic devices to respective sub-mounts on the first wafer, and bonds a second wafer to the first wafer with the lasers hermetically sealed in cavities corresponding to the depressions in the second wafer. The reflective areas in the depressions act as turning mirrors for side emitting lasers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.