Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus
US6998704B2 · kind B2 · utility
37Cited by
1References
56Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2003 |
| Grant date | Feb 14, 2006 |
| Priority date | — |
| Expiry date | Jan 7, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.