Semiconductor device and method for manufacturing the same
US6998712B2 · kind B2 · utility
93Cited by
0References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2003 |
| Grant date | Feb 14, 2006 |
| Priority date | — |
| Expiry date | Aug 28, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a provided semiconductor device, a plurality of seal rings each made of a conductive material is formed along a periphery of the semiconductor chip and as to surround the circuit formation portion, the seal rings being connected with the semiconductor substrate and being buried in the plurality of wiring insulating films in such a manner as to extend over the wiring insulating films, and one or more slit-like notches are formed at specified positions in the plurality of seal rings in such a manner that the respective slit-like notches in two seal rings being adjacent to each other are not aligned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.