Conductor board and method for producing a conductor board
US7000316B2 · kind B2 · utility
2Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2003 |
| Grant date | Feb 21, 2006 |
| Priority date | — |
| Expiry date | Apr 2, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49218
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The conductor board has at least one layer of a dielectric provided areally on two mutually opposed faces with at least one metalization on each. There is at least one through contacting in the region of an aperture. The metalizations are applied to cover at least one aperture and are electrically connected to each other through the aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.