Stencil and apparatus for supporting and tensioning the stencil
US7000538B2 · kind B2 · utility
0Cited by
12References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 29, 2004 |
| Grant date | Feb 21, 2006 |
| Priority date | — |
| Expiry date | Nov 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/1216
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A support and tensioning frame for a stencil to enable solder paste to be applied to printed circuit boards and other electronic substrates includes a support frame engaged with at least two opposed mounting members. Each mounting member includes at least one projection for engaging an aperture in a stencil to mount the stencil under tension. A permanent-biasing mechanism engages one or more of the mounting members to place the stencil under tension. A second biasing mechanism engages the mounting member to provide a bias opposite that of the permanent-biasing mechanism to facilitate release of a mounted stencil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.