Method and apparatus for improving an integrated circuit device
US7000821B2 · kind B2 · utility
2Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2003 |
| Grant date | Feb 21, 2006 |
| Priority date | — |
| Expiry date | Oct 23, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus provides increased operative life for flip-chip devices that are produced from an integrated circuit formed with electrically conductive bumps bonded to a printed circuit board substrate. The bumps and the substrate are formed from similar materials that allow control of the degree of latency for each element and produce a covalently bonded laminate structure when the bumps and substrate are brought together. The covalently bonded structure decreases bump fatigue to lengthen the operative life of the flip-chip device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.