Throughplating of flexible printed boards

US7000845B2 · kind B2 · utility

Assignee

• GIESECKE & DEVRIENT GMBH · DE

Inventors

• Ando Welling · Isen, DE
• Matthias Bergmann · Hersbruck, DE
• Joachim Hoppe · Munich, DE

Key dates

• Filing date: May 6, 2002
• Grant date: Feb 21, 2006
• Expiry date: May 6, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/1572
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

For throughplating flexible circuit boards, two electrically conductive layers located on opposing surfaces are electrically interconnected by cutting through the circuit board using a simple cutting tool for producing a passage. A defined quantity of conductive material is then inserted optionally into the through hole.