Patent · US Expired

Device for chip removing machining

US7001114B2 · kind B2 · utility

23Cited by

5References

10Claims

0Family size

Assignee

Seco Tools AB · SE

Inventors

Mats Blücher · Fagersta, SE
Jonas Boman · Falun, SE
Thomas Eriksson · Gothenburg, SE
Jan-Olf Lundeqvist · Fagersta, SE
Kaj Virtanen · Fagersta, SE

Key dates

Filing date	Jul 1, 2003
Grant date	Feb 21, 2006
Priority date	—
Expiry date	Apr 14, 2024

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T408/90993
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

An apparatus for chip removing machining includes first and second parts which are intercoupled by a coupling. The coupling includes two interacting surfaces disposed on the first and second parts, respectively. The interacting surfaces are profiled to intermesh with one another to define an intermeshing region of the coupling. Each of the surfaces is profiled with first and second sets of grooves which define first and second main directions, respectively, which extend transversely to one another. At least one groove on each of the surfaces extends across less than the entire intermeshing region, wherein the surfaces define only one coupling position for the first and second parts.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.