Molding resin composition and method of molding
US7001560B2 · kind B2 · utility
0Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2001 |
| Grant date | Feb 21, 2006 |
| Priority date | — |
| Expiry date | Dec 31, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14387
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides a resin composition suitable for molding a microscopic structure that has small cure shrinkage, good mold transfer properties and excellent properties for post-processing such as polishing processing and laser processing. Such a resin is a thermosetting resin composition comprising 95 to 35 wt % of a thermosetting resin and 5 to 65 wt % of organic filler having a particle size of 10 μm or less. From such a resin, an ink ejecting apparatus having a microscopic structure, for example, a nozzle of a diameter of 30 μm, is integrally molded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.