Rigid multilayer material for thermal insulation
US7001656B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2003 |
| Grant date | Feb 21, 2006 |
| Priority date | — |
| Expiry date | Apr 23, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
The invention relates to a rigid multilayer material for thermal insulation, in particular in a vacuum, the material comprising at least one insulating plate of honeycomb material sandwiched between two aluminum- or gold-coated skins of low emissivity. In order to optimize thermal insulation, the diameter of the cells is at least twice their height. The multilayer material may have as many layers as needed. The cells of adjacent layers may be offset in order to further minimize paths for heat conduction through the structure. Holes may be pierced in the side walls of the cells in order to allow them to empty out when the material is put into a vacuum. The invention also provides a method of making such a material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.