Intermediate substrate
US7002075B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2005 |
| Grant date | Feb 21, 2006 |
| Priority date | — |
| Expiry date | May 11, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/85
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An intermediate substrate includes a substrate core formed by a main core body portion constructed of a sheet of polymer material and having a subsidiary core accommodation portion formed therein. A ceramic subsidiary core portion, which is constructed of a ceramic sheet, is accommodated in the subsidiary core accommodation portion and is of a thickness matching that of the main core body portion. A thin film capacitor is formed on a first main surface side of a plate-like base of the core portion and includes first and second thin film electrodes separated from each other by a thin film dielectric layer so as to provide direct current isolation between the electrodes. First and second direct current isolated terminals of a first terminal array are electrically connected to the first and second thin film electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.