Patent · US Expired

Transition from a waveguide to a microstrip having a secured arrangement

US7002431B2 · kind B2 · utility

2Cited by
4References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 9, 2004
Grant dateFeb 21, 2006
Priority date
Expiry dateSep 9, 2024

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01P5/107
  • WIPO fieldTelecommunications
  • WIPO sectorElectrical engineering

Abstract

A transition from a waveguide to a microstrip, including a substrate having a plurality of ground surfaces superimposed on one another, the microstrip extending on the substrate and a plurality of through-contacts providing electrical connectivity to the plurality of ground surfaces. Wherein the waveguide includes a waveguide wall with an opening therein, the substrate projecting through the opening into the waveguide such that at least a portion of the microstrip is disposed within the waveguide, at least one of the plurality of ground surfaces being in contact with the waveguide wall.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.