Transition from a waveguide to a microstrip having a secured arrangement
US7002431B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2004 |
| Grant date | Feb 21, 2006 |
| Priority date | — |
| Expiry date | Sep 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/107
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A transition from a waveguide to a microstrip, including a substrate having a plurality of ground surfaces superimposed on one another, the microstrip extending on the substrate and a plurality of through-contacts providing electrical connectivity to the plurality of ground surfaces. Wherein the waveguide includes a waveguide wall with an opening therein, the substrate projecting through the opening into the waveguide such that at least a portion of the microstrip is disposed within the waveguide, at least one of the plurality of ground surfaces being in contact with the waveguide wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.