Mold components having a conformal thermal management system and methods for manufacturing same
US7004221B2 · kind B2 · utility
8Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2002 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Jul 28, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/7337
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a mold component having a conformal thermal management system comprises forming a first mold segment and a second mold segment, each comprising a surface having a profile defined by the surface. A channel pattern is disposed beneath the profile defined by the surface in at least one of the first mold segment and second mold segment. The first mold segment and second mold segment are aligned to form a network of channels. The first mold segment and second mold segment are joined together to form the mold component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.