Capillary with contained inner chamfer
US7004369B2 · kind B2 · utility
3Cited by
24References
50Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2005 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Jan 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle of less than about 60 degrees. The inner annular chamfer is coupled to a lower portion of a cylindrical passage formed in the bonding tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.