Solder printing mask, wiring board and production method thereof, electrooptical apparatus and production method thereof and electronic device and production method thereof
US7004376B2 · kind B2 · utility
2Cited by
8References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 19, 2003 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Sep 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is provided a mask for use in printing solder on a plurality of terminals formed on a substrate so as to correspond to a plurality of terminals of an IC package. The mask has openings through which the solder is applied, and the openings are larger than the terminals. Although a wiring line adjacent to the terminals may be covered with the solder, a reflow process causes the solder to be divided into a first portion and a second portion, thus preventing short-circuits between the wiring line and the terminals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.