Hermetic chip-scale package for photonic devices
US7004644B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 29, 1999 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Jun 29, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A package having one or more integrated circuit photonic devices in a hermetically sealed enclosure. The photonic devices may be sources or detectors of light. The sealed enclosure consists of a transparent window attached to a first level housing. The transparent window contains patterned electrically conductive traces for purposes of routing electrical signals to and from semiconductor chip, which is bonded to patterned window. A second level housing is attached to the first level housing, and aligned via mechanical features incorporated with the transparent window. The second level housing provides a receptacle for a plug having light waveguides or optical fibers that are aligned with the photonic devices when inserted through the plug receptacle. One or more pins are inserted through the plug and the second level housing to secure the plug in the receptacle to the hermetically sealed photonic devices, such as VCSEL's on an integrated circuit semiconductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.